OR: outer radius 外半径
H: Hole Diameter 劈刀内部通孔最小孔径
CD: Chamfer Diameter 劈刀端口直径
T: Tip Diameter 尖端直径
ICA: Inner Chamfer Angle内倒角角度
OD: Outer Diameter 外径
CA: Cone Angle 圆锥角度
根据线径来选择劈刀H的直径
劈刀直径选择 球径范围和劈刀CD 劈刀的CD能精确控制球径 Bond Pad Pitch两个芯片中心点之间的距离
CD
劈刀关键设计规则
H = WD + Hole clearance
Hole clearance is proportional to WD
T > BPP > BPO > Ball dia > CD > H > WD~OR
T > CD + (2xOR) to maintain Tip effective face
Tip effective face = f (T,OR,CD)
Effective face = T – CD – (2xOR) > 0
CD = H + (2 x IC)
Inner Chamfer length = f (H,CD, ICA)
CD = H + (2xIC) or IC = (CD – H)/2
Inner Chamfer Volume = f (H, CD, ICA)
VNeck + VIC + VSquash = VFAB
OR is ~ WD
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