CECB2B元器件前沿：Mentor28届印刷电路板PCB技术奖名单，中兴上榜
元器件交易资讯CECB2B 电子行业资讯
Mentor, a Siemens business, today announced the winners for its 28th printed circuit board (PCB) Technology Leadership Awards. Established in 1988, this program is the longest-running competition of its kind in the electronic design automation (EDA) industry. The program recognizes engineers and designers who use innovative methods and design tools to address highly complex PCB system design challenges and produce industry-leading products.
Mentor，aSiemens business日前公布第28届印刷电路板（PCB）技术领导奖（TLA）的获奖名单。此计划成立于1988年，是电子设计自动化（EDA）产业中历史最悠久的PCB设计技术竞赛，旨在表彰采用创新方法和设计工具来因应高复杂度PCB系统设计挑战，并开发出业界领先产品的工程师和设计人员。
Prominent experts in the PCB industry judged entries from around the world in categories representing a wide variety of markets and industries, including:
由PCB产业知名专家组成的评审团对来自世界各地的参赛作品进行了评选，奖项涵盖不同的市场和产业类别，包含：
Computers, blades and servers, memory systems 电脑、服务器和存储系统
Consumer electronics and handheld designs 消费类电子产品和手持式产品设计
Industrial control, instrumentation, security and medical applications工业控制、仪器仪表、安全与医疗应用
Military and aerospace solutions军事与航空航天解决方案
Telecom, network controllers, line cards电信、网络控制器、线卡
Transportation and automotive designs运输与汽车设计
The PCB Technology Leadership Awards contest is open to any designs created with Mentor PCB solutions. Judging is based on design complexity and overcoming associated challenges, such as small form factors, high-speed protocols, multi-discipline team collaboration, advanced PCB fabrication technologies, and design-cycle time reduction.
凡是利用Mentor PCB解决方案开发的设计都可以参加PCB技术领导奖的竞赛。评审根据设计复杂度和克服的相关挑战来进行评审，例如小尺寸、高速协议、跨领域团队协作、先进PCB制造技术，以及缩短设计周期等。
The panel of expert judges this year included Dr. Rajan Bedi, Spacechips CEO and founder; Stephen Chavez, Collins Aerospace staff engineer and global technical lead, CID+; Michael R. Creeden, Insulectro technical director design education, CID+; Gary Ferrari, FTG Circuits technical support director; Rick Hartley, RHartley Enterprises principal engineer; Steve Herbstman, SHLC founder and lead designer; Happy Holden, Gentex Corporation (retired); Pete Waddell, president of UP Media and publisher of Printed Circuit Design & Fab/Circuits Assembly Magazine; and Susy Webb, Fairfield Nodal senior PCB designer.
今年的专家评审团成员包括：Spacechips执行长暨创办人Rajan Bedi博士、Collins Aerospace工程师暨全球技术负责人Stephen Chavez（CID+认证）、Insulectro设计教育技术总监Michael R. Creeden（CID+认证）、FTGCircuits技术支持总监Gary Ferrari、RHartley Enterprises总工程师Rick Hartley、SHLC创办人暨首席设计师Steve Herbstman、Gentex Corporation的Happy Holden（已退休）、UP Media总裁暨《PrintedCircuit Design & Fab/Circuits Assembly》杂志发行人Pete Waddell，以及FairfieldNodal资深PCB设计师Susy Webb。
今（2020）年技术领导奖获奖者使用了Xpedition Enterprise软件、PADS软件。最佳整体设计奖项由Infinera获得；其他六大产业类别奖项获奖名单如下：
中发智造整理
2020 Technology Leadership Award Winners
Best Overall Design 最佳总体设计
Company:Infinera
Design team:Infinera & Jabil Team
Using:Xpedition™ Enterprise software
英飞朗Infinera
设计团队：Infinera & Jabil 团队
使用：Xpedition™ Enterprise 软件
Infinera, Finland
Computers, Blade & Servers, Memory Systems 电脑、服务器和存储器系统
Company:ZTE
Design team:Zhang Meijuan, Guo Qian, Yao Xueying, Fan Xiaxia, Meng Liqiang, Ao Xiaodong & Zhang Hailong
Using:Xpedition Enterprise
ZTE
设计团队：张美娟、郭倩、姚雪盈、樊瑕瑕、孟利强、敖小东、张海
使用：Xpedition Enterprise
ZTE, China
Consumer Electronics & Handheld消费类电子产品和手持式产品
Company:Tessolve Semiconductor
Design team:ATE Design Team
Using:Xpedition Enterprise
Tessolve Semiconductor
设计团队：ATE 设计团队
使用产品：Xpedition Enterprise
Tessolve Semiconductor, India
Industrial Control, Instrumentation, Security & Medical工业控制、仪器仪表、安全与医疗应用
Company:CiBOARD electronic
Design team:Thomas Blasko & Michael Schwitzer
Using:Xpedition Enterprise
CiBOARD electronic, Germany
Military & Aerospace军事与航空航天解决方案
Company:Abaco Systems
Design team:Jim Rose, Rob Savage, James McDonald & Martin McGregor
Using:Xpedition Enterprise
Abaco Systems, UKCategory: Military & Aerospace
Telecom, Network Controllers, Line Cards电信、网络控制器、线卡
Company:Sienna Ecad Technologies
Design team:Rajkumar Ramadoss, Narasimha Rao & Vijayakumar K
Using:Xpedition Enterprise
Sienna Ecad Technologies, India
Transportation & Automotive运输与汽车设计
Company:Nobo Automotive Systems
Design team:Li Yue, Wang Zelong, Huang Wenjuan, Cheng Xunzhuang, Lu Shuai & Tong Qi
Using:Xpedition Enterprise
Nobo Automotive Systems
设计团队：李岳、王泽龙、黄文娟、陆帅、童琦、程训壮
使用产品：Xpedition Enterprise
Nobo Automotive Systems, China
Honorable Mention佳作奖
Company:Adcom
Design team:Moshe Frid, Greg Kaplan, Galya Makloof, Boris Abramovich, Tamir Yampolsky & Haim Anava
Using:Xpedition Enterprise
Company:Honeywell Technology Solutions Lab
Design team:Siddanagouda Bhasagi, Veeresh Goure & Mayank Bhaintwal
Using:Xpedition Enterprise
Company:Tessolve Semiconductor - 1271
Design team:SathishKumar Kalaiselvan, Manikandan Ravi, Karthick Sathiyaseelan & Kishore Subramani
Using:PADS™ software
Company:Honeywell Technology Solutions Lab - 1322
Design team:Mayank Bhaintwal, Veeresh Goure & Siddanagouda Bhasagi
Using:Xpedition Enterprise
Adcom, Israel Category: Significant
Honeywell Technology Solutions Lab, India
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