1.Wafer design 晶圆设计--Wafer Fab晶圆制造--Wafer probe晶圆测试--Assembly &Test 封装测试
2.Package 封装形式：
QFN：Quad flat No-lead package
SOP：small outline package
SOT：Small Outline Package
TSSOP：Thin Small Shink out line Package
3.Raw Material in Assembly 封装原材料
m
Lead Fram 框架、wire 焊线、Epoxy银浆、EMC（mold compound）塑封料
4.Assembly process 封装工艺
4.1 Front of line
FOL
Back Grinding 背面减薄：Taping、back grinding、De Taping
Wafer Saw 晶圆切割：Wafer mount 、Wafer Saw、 wafer wash
Die Attach 上芯：Write Epoxy点银浆、Die attach、Epoxy Cure银浆固化
Wire Bond 焊线
Quality control
4.2 End of line
EOL
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